JW-77 Acidic Bright Copper Plating Process


Mirror‑bright coatings can be obtained over a wide range of current densities, and even in low‑current‑density regions, coatings with exceptionally high leveling and brightness can be achieved.

01

Fast brightening and exceptionally high leveling and gloss.

02

Mirror‑bright coatings can be obtained over a wide range of current densities, and even in low‑current‑density regions, coatings with exceptionally high leveling and brightness are achievable.

03

It has a wide operating temperature range, with good coating quality achievable between 18 and 40°C.

04

It exhibits exceptionally high impurity tolerance, and the coating is resistant to pinholes, pitting, and white haze.

05

Easy to operate, with low brightener consumption.

06

The brightener exhibits exceptionally high stability and excellent compatibility, blending readily with any other brightener and facilitating easy tank transfer.

07

It is easy to operate and convenient to maintain. The materials are widely available, resulting in low costs.

Process Formulation and Operating Procedures

  Scope Standard
Copper sulfate 120~200 g/L 180g/L
Sulfuric acid 40~90 g/L 70g/L
Chloride ion 50~90 mg/L 60mg/L
JW-77C agent 2~8 ml/L 4ml/L
JW-77A agent 0.3~0.6 ml/L 0.5ml/L
JW-77B agent 0.4~0.8 ml/L 0.5ml/L
Temperature 18~40℃ 28°C
Cathodic current density 1.5~8 A/dm²  
Anode current density 0.5~3 A/dm²  
Anode (phosphor bronze plate) Contains 0.1–0.3% phosphorus  
Stir Cathode movement or air stirring  
Voltage 2~10V  

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JW-77 Acidic Bright Copper Plating Process

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