JW-76 Barrel Plating Bright Acid Copper Process
Brightening additives are specifically designed for barrel‑plating acidic copper processes. These additives offer rapid brightening, a broad brightening range, and fine‑grained deposits, while also providing excellent bath stability and extended processing cycles.
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Brightening additives are specifically designed for barrel‑plating acidic copper processes. These additives offer rapid brightening, a broad brightening range, and fine‑grained deposits, while also providing excellent bath stability and extended processing cycles.
Process scope
| Name | Scope | Standard | |||
| Copper sulfate (g/L) | 130-170 | 150 | |||
| Sulfuric acid (g/L) | 80–120 | 100 | |||
| Chloride ion (mg/L) | 40–120 | 60 | |||
| JW-76A agent (mL/L) | 0.4---0.8 | 0.6 | |||
| JW-76B agent (mL/L) | 0.3---0.6 | 0.5 | |||
| JW-76C agent (mL/L) | 6–10 | 8 | |||
| Temperature (°C) | 15–20 | 18 | |||
| Cathodic current density (A/dm²) | 1--2 | 1.5 | |||
| Anodic current density (A/dm²) | 0.6---1.2 | 1.0 | |||
| Anode | Phosphorus-containing copper | Phosphorus-containing copper | |||
| Filter | Continuous filtration | Continuous filtration | |||
| Stir | Air stirring | Air stirring | |||
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JW-76 Barrel Plating Bright Acid Copper Process
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